Semiconductor Foundries Industr
1.2. Total Revenue Trends of Major IC Foundries
1.3. Advanced Process Node: Shipment Revenue & Shipment by Applications
1.4. Advanced Process Node: Production Capacity & Maker Share in 2023F
1.5. 3nm Shipment Revenue and Capacity Trends (CY2021-CY2024)
1.6. 3nm Capacity by IC Foundry and Customers 2023F
1.7. 4/5nm Shipment Revenue and Capacity Trends (CY2021-CY2024)
1.8. 4/5nm Capacity by IC Foundry and Customers 2023F
1.9. 6/7nm Shipment Revenue and Capacity Trends (CY2021-CY2024)
1.10. 6/7nm Capacity by IC Foundry and Customers 2023F
1.11. 8/10nm Shipment Revenue and Capacity Trends (CY2021-CY2024)
1.12. 8/10nm Capacity by IC Foundry and Customers 2023F
1.13. 11/12/14/16nm Shipment Revenue and Capacity Trends (CY2021-CY2024)
1.14. 11/12/14/16nm Capacity by IC Foundry and Customers 2023F
1.15. Utilization Rate Trends
1.16. Overview of Capacity Expansion & Utilization Rate Trends
1.17. Utilization Rate Trends by each Process Node (From 40/45nm to 3nm)
1.18. IC Foundry Revenue Forecast by Process Node 2023F & 2024F
1.19. Manufacturing Process Procedure of Semiconductor
II. Market Overview by Advanced Process Node
2.1. Changing Major Applications Demands for Process Migration
2.2. Process Node Movement by Major Applications
2.3. Process Node Coverage by IC Foundries
2.4. Market Overview of Each Advanced Process Node
2.5. Market Overview of 3nm Process Node
2.6. Wafer Shipment Volumes of 3nm by Applications
2.7. Wafer Shipment Volumes of 3nm by Customers
2.8. 3nm Process Migration Movement by Major Applications
2.9. Roadmap of Samsung Foundry Advanced Process beyond 3nm
2.10. Market Overview of 4/5nm Process Node
2.11. Wafer Shipment Volumes of 5nm by Applications
2.12. Wafer Shipment Volumes of 4/5nm by Customers
2.13. Market Overview of 6/7nm Process Node
2.14. Wafer Shipment Volumes of 6/7nm by Applications
2.15. Wafer Shipment Volumes of 6/7nm by Customers
2.16. Market Overview of 8/10nm Process Node
2.17. Wafer Shipment Volumes of 8/10nm by Applications
2.18. Wafer Shipment Volumes of 8/10nm by Customers
2.19. Market Overview of 11/12/14/16nm Process Node
2.20. Wafer Shipment Volumes of 11/12/14/16nm by Applications
2.21. Wafer Shipment Volumes of 11/12/14/16nm by Customers 1
2.22. Wafer Shipment Volumes of 11/12/14/16nm by Customers 2
2.23. Wafer Shipment Volumes of 11/12/14/16nm by Customers 3
2.24. Capacity Expansion Trends by Node
2.25. Major Legacy Process Node List (28nm, 40nm, 55/65nm)
2.26. IC Foundries Including Tier2 Foundries Revenue Share 2021-2024
2.27. Wafer Average ASP by Process Node
2.28. Japanese New Semiconductor Company: Rapidus株式会社(Rapidus Corporation) 1
2.29. Japanese New Semiconductor Company: Rapidus株式会社(Rapidus Corporation) 2
2.30. Japanese New Semiconductor Company: Rapidus株式会社(Rapidus Corporation) 3
III. Market Topics
3.1. New Packaging Technologies by IC Foundry (TSMC & Samsung Foundry)
3.2. Market Trend of Chiplet Technology
3.3. Structure of Chiplet Technology
3.4. Intel Foundry Roadmap
3.5. Intel Major Capacity Expansion Plan
3.6. Intel 2.0 Strategy Plan by Locations
3.7. FinFET (Fin Field-Effect Transistor) & GAA (Gate All Around) for Advanced Node
3.8. New Structure of Transistor：Post GAA (Gate All Around)
3.9. PPA(Power, Performance, Area) Improvements of New Process Technologies
3.10. Mask Blanks and Photo Mask Entries Makers Trends
3.11. Entry Schedule of Metal Resist
3.12. Maker Share for Total Photo Resist and EUV Resist in 2022F
3.13. Inspection of EUV Photo Mask
2023/1/19 TECHNO SYSTEMS RESEARCH CO., LT
Table of Conte
3.14. ASMLの売上額及びEUV装置の出荷予
3.15. ASML：Forecast of EUV Shipments
3.16. Advanced Process Node Capacity & Average EUV Layers
3.17. Capital Expenditure Forecast by IC Foundries
IV. Individual Sheets
4.1. TSMC：Advanced Process Wafer Capacity & Shipment, Utilization & Yield Rate
4.2. TSMC：Production Capacity Forecast by Process Node
4.3. TSMC：Wafer Revenue by Process Node
4.4. TSMC: Market Strategies & Outlook
4.5. Samsung Foundry：Advanced Process Wafer Capacity & Shipment, Utilization & Yield Rate
4.6. Samsung Foundry Production Capacity Forecast by Process Node
4.7. Samsung Foundry：Wafer Revenue by Process Node
4.8. Samsung Foundry: Market Strategies & Outlook
4.9. SMIC：Advanced Process Wafer Capacity & Shipment, Utilization & Yield Rate
4.10. SMIC：Production Capacity Forecast by Process Node
4.11. GlobalFoundries：Advanced Process Wafer Capacity & Shipment, Utilization & Yield Rate
4.12. GlobalFoundries：Production Capacity Forecast by Process Node
4.13. GlobalFoundries：Wafer Revenue by Process Node & Customers by Advanced Node
4.14. GlobalFoundries：Production Capacity Forecast by Process Node
4.15. UMC：Wafer Revenue by Process Node
4.16. UMC：Production Capacity Forecast by Process Node
