主要IC Foundry生産・出荷統計レポート 1H2022分

本レポート『主要IC Foundry生産・出荷統計レポート 1H2022分』は大手IC Foundryメーカーの先端プロセス毎の生産キャパシティ及び増設計画、アプリケーション別出荷状況、マーケットシェア等の分析を行っています。

先端プロセスのカバレッジ：11/12/14/16nm, 8/10nm, 6/7nm, 4/5nm, 3nm

半導体関連企業が世界の市場動向を的確に把握し、マーケティング戦略を立案する上で一助となり得ることを目的としたマルチクライアント調査レポートである。（メモリー分野は調査に含んでおりません）

I. Executive Summary
    1.1. Market Overview of Semiconductor Foundries Industry
    1.2. Total Revenue Trends of Major IC Foundries
    1.3. Advanced Process Node: Shipment Revenue & Shipment by Applications
    1.4. Advanced Process Node: Production Capacity & Maker Share in 2022F
    1.5. 3nm Shipment Revenue and Capacity Trends (CY2021-CY2024)
    1.6. 3nm Capacity by IC Foundry and Customers 2022F
    1.7. 4/5nm Shipment Revenue and Capacity Trends (CY2021-CY2024)
    1.8. 4/5nm Capacity by IC Foundry and Customers 2022F
    1.9. 6/7nm Shipment Revenue and Capacity Trends (CY2021-CY2024)
    1.10. 6/7nm Capacity by IC Foundry and Customers 2022F
    1.11. 8/10nm Shipment Revenue and Capacity Trends (CY2021-CY2024)
    1.12. 8/10nm Capacity by IC Foundry and Customers 2022F
    1.13. 11/12/14/16nm Shipment Revenue and Capacity Trends (CY2021-CY2024)
    1.14. 11/12/14/16nm Capacity by IC Foundry and Customers 2022F
    1.15. Manufacturing Process Procedure of Semiconductor
    1.16. 12inch Capacity and Utilization Rate Forecast
    1.17. Supply Chain Business Condition From Foundry to End markets
    1.18. Possibility of Market Correction ??
    1.19. Revenue basis : Possible of Market correction
    1.20. Capacity basis : Possible of Market correction
II. Market Overview by Advanced Process Node
    2.1. Process Node by Major Applications
    2.2. Process Node Migration by Major Applications
    2.3. Process Node Coverage by IC foundries
    2.4. Market Overview of Each Advanced Process Node
    2.5. Market Overview of 3nm Process Node
    2.6 Wafer Shipment Volumes of 3nm by Applications
    2.7. Possible Customers 3nm Process Node
    2.8 Roadmap of TSMC advanced process beyond 3nm
    2.9 Roadmap of TSMC advanced process beyond 3nm
    2.10. Market Overview of 4/5nm Process Node
    2.11. Wafer Shipment Volumes of 5nm by Applications
    2.12. Wafer Shipment Volumes of 5nm by Customers
    2.13. Market Overview of 6/7nm Process Node
    2.14. Wafer Shipment Volumes of 6/7nm by Applications
    2.15. Wafer Shipment Volumes of 6/7nm by Customers
    2.16. Market Overview of 8/10nm Process Node
    2.17. Wafer Shipment Volumes of 8/10nm by Applications
    2.18. Wafer Shipment Volumes of 8/10nm by Customers
    2.19. Market Overview of 11/12/14/16nm Process Node
    2.20. Wafer Shipment Volumes of 11/12/14/16nm by Applications
    2.21. Wafer Shipment Volumes of 11/12/14/16nm by Customers 1
    2.22. Wafer Shipment Volumes of 11/12/14/16nm by Customers 2
    2.23. Wafer Shipment Volumes of 11/12/14/16nm by Customers 3
    2.24. Capacity Expansion Trends by Node
    2.25. 28nm Process Node Capacity Expansion & Market Share
    2.26. Major Legacy Process Node List (28nm, 40nm, 55/65nm)
    2.27. IC Foundries Including Tier2 Foundries Revenue Share 2021-2024
    2.28. Wafer Average ASP by Process Node
III. Market Topics
    3.1. New Packaging Technologies by IC Foundry (TSMC & Samsung Foundry)
    3.2. Market Trend of Chiplet Technology
    3.3. Structure of Chiplet Technology
    3.4. Intel IDM 2.0 Business Strategy
    3.5. Intel Process Node Roadmap
    3.6. Intel Major Capacity Expansion Plan
    3.7. Intel 2.0 Strategy Plan by Locations
    3.8. FinFET (Fin Field-Effect Transistor)とGAA (Gate All Around) for Advanced Node
    3.9. New Structure of Transistor：Post GAA (Gate All Around)
    3.10. PPA(Power, Performance, Area) Improvements of New Process Technologies
    3.11. Mask Blanks and Photo Mask Entries Makers Trends
    3.12. Entry Schedule of Metal Resist
    3.13. Resist Market Share & JSR Acquisition of Inpria
    3.14. Inspection of EUV Photo Mask
    3.15. ASMLの売上金額及びEUV装置の出荷予想
    3.16. ASML：Forecast of EUV Shipments
    3.17. Advanced Process Node Capacity & Average EUV Layers
    3.18. Capital Expenditure Forecast by IC Foundries
    3.19. 事故、停電、操業停止等のトピックス
    3.20. 事故、停電、操業停止等のトピックス　2020年後半から 1
    3.21. 事故、停電、操業停止等のトピックス　2020年後半から 2
    3.22. 事故、停電、操業停止等のトピックス　2020年後半から 3
    3.23. 事故、停電、操業停止等のトピックス　2020年後半から 4
IV. Individual Sheets TSMC, Samsung Foundry, SMIC, GlobalFoundries, UMC
    4.1. TSMC：Advanced Process Wafer Capacity & Shipment, Utilization & Yield Rate
    4.2. TSMC：Production Capacity Forecast by Process Node
    4.3. TSMC：Wafer Revenue by Process Node
    4.4. TSMC: Market Strategies & Outlook
    4.5. Wafer Shipment of TSMC Customers by Advanced Process Node
    4.6. Samsung Foundry：Advanced Process Wafer Capacity & Shipment, Utilization & Yield Rate
    4.7. Samsung Foundry Production Capacity Forecast by Process Node
    4.8. Samsung Foundry：Wafer Revenue by Process Node
    4.9. Samsung Foundry: Market Strategies & Outlook
    4.10. Wafer Shipment of Samsung Foundry Customers by Advanced Process Node
    4.11. SMIC：Advanced Process Wafer Capacity & Shipment, Utilization & Yield Rate
    4.12. SMIC：Production Capacity Forecast by Process Node
    4.13. SMIC：Wafer Revenue by Process
    4.14. SMIC：Customers by Advanced Node & Market Strategies & Outlook
    4.15. GlobalFoundries：Advanced Process Wafer Capacity & Shipment, Utilization & Yield Rate
    4.16. GlobalFoundries：Production Capacity Forecast by Process Node
    4.17. GlobalFoundries：Wafer Revenue by Process Node & Customers by Advanced Node
    4.18. GlobalFoundries：Customers by Advanced Node & Market Strategies & Outlook
    4.19. UMC：Wafer Revenue by Process Node
    4.20. UMC：Production Capacity Forecast by Process Node