その他半導体

主要IC Foundry生産・出荷統計レポート 2H2021分

このレポートについて問合せる
発刊年月 2021/12
体裁 A4 :91ページ
価格(税抜価格表示) 
500,000円(日本語/ハードコピー)
概要
本レポート『主要IC Foundry生産・出荷統計レポート 2H2021分』は大手IC Foundryメーカーの先端プロセス毎の生産キャパシティ及び増設計画、アプリケーション別出荷状況、マーケットシェア等の分析を行っています。

先端プロセスのカバレッジ：11/12/14/16nm, 8/10nm, 6/7nm, 4/5nm, 3nm

半導体関連企業が世界の市場動向を的確に把握し、マーケティング戦略を立案する上で一助となり得ることを目的としたマルチクライアント調査レポートである。（メモリー分野は調査に含んでおりません）
 
目次
I. Executive Summary
    1.1. Market Overview of Semiconductor Foundries Industry
    1.2. Total Revenue Trends of Major IC Foundries
    1.3. Advanced Process Node: Shipment Revenue & Shipment by Applications
    1.4. Advanced Process Node: Production Capacity & Maker Share in 2021F
    1.5. 3nm Shipment Revenue and Capacity Trends (CY2020-CY2023)
    1.6. 3nm Capacity by IC Foundry and Customers 2021F 
    1.7. 4/5nm Shipment Revenue and Capacity Trends (CY2020-CY2023)
    1.8. 4/5nm Capacity by IC Foundry and Customers 2021F 
    1.9. 6/7nm Shipment Revenue and Capacity Trends (CY2020-CY2023)
    1.10. 6/7nm Capacity by IC Foundry and Customers 2021F 
    1.11. 8/10nm Shipment Revenue and Capacity Trends (CY2020-CY2023)
    1.12. 8/10nm Capacity by IC Foundry and Customers 2021F
    1.13. 11/12/14/16nm Shipment Revenue and Capacity Trends (CY2020-CY2023)
    1.14. 11/12/14/16nm Capacity by IC Foundry and Customers 2021F
    1.15. Manufacturing Process Procedure of Semiconductor 
    1.16. 12inch Capacity and Utilization Rate Forecast 
    1.17. Increasing of Inventory Turnover Day (TSMC & UMC)
II. Market Overview by Advanced Process Node
    2.1. Process Node by Major Applications
    2.2. Process Node Migration by Major Applications
    2.3. Process Node Coverage by IC foundries 
    2.4. Market Overview of Each Advanced Process Node 
    2.5. Market Overview of 3nm Process Node
    2.6. Possible Customers 3nm Process Node
    2.7. Market Overview of 4/5nm Process Node
    2.8. Wafer Shipment Volumes of 5nm by Applications 
    2.9. Wafer Shipment Volumes of 5nm by Customers 
    2.10. Market Overview of 6/7nm Process Node
    2.11. Wafer Shipment Volumes of 6/7nm by Applications
    2.12. Wafer Shipment Volumes of 6/7nm by Customers 
    2.13. Market Overview of 8/10nm Process Node
    2.14. Wafer Shipment Volumes of 8/10nm by Applications 
    2.15. Wafer Shipment Volumes of 8/10nm by Customers 
    2.16. Market Overview of 11/12/14/16nm Process Node
    2.17. Wafer Shipment Volumes of 11/12/14/16nm by Applications 
    2.18. Wafer Shipment Volumes of 11/12/14/16nm by Customers 1
    2.19. Wafer Shipment Volumes of 11/12/14/16nm by Customers 2
    2.20. Wafer Shipment Volumes of 11/12/14/16nm by Customers 3
    2.21. Capacity Expansion Trends by Node
    2.22. 28nm Process Node Capacity Expansion & Market Share
    2.23. Major Legacy Process Node List (28nm, 40nm, 55/65nm)
    2.24. IC Foundries Including Tier2 Foundries Revenue Share 2021-2023
    2.25. Wafer Average ASP by Process Node
III. Market Topics
    3.1. New Packaging Technologies by IC Foundry (TSMC & Samsung Foundry)
    3.2. Market Trend of Chiplet Technology
    3.3. Structure of Chiplet Technology
    3.4. Intel IDM 2.0 Business Strategy
    3.5. Intel Process Node Roadmap
    3.6. TSMC ＆ Samsung Foundryの先端プロセスロードマップ
    3.7. FinFET (Fin Field-Effect Transistor)とGAA (Gate All Around) for Advanced Node
    3.8. New Structure of Transistor：Post GAA (Gate All Around)
    3.9. PPA(Power, Performance, Area) Improvements of New Process Technologies
    3.10. Mask Blanks and Photo Mask Entries Makers Trends
    3.11. Entry Schedule of Metal Resist 
    3.12. Resist Market Share & JSR Acquisition of Inpria
    3.13. Inspection of EUV Photo Mask
    3.14. ASMLの売上金額及びEUV装置の出荷予想
    3.15. ASML：Forecast of EUV Shipments
    3.16. Capital Expenditure Forecast by IC Foundries
    3.17. 事故、停電、操業停止等のトピックス
    3.18. 事故、停電、操業停止等のトピックス 2020年後半から 1
    3.19. 事故、停電、操業停止等のトピックス 2020年後半から 2
    3.20. 事故、停電、操業停止等のトピックス 2020年後半から 3
    3.21. 事故、停電、操業停止等のトピックス 2020年後半から 4
IV. Individual Sheets
    4.1. TSMC：Advanced Process Wafer Capacity & Shipment, Utilization & Yield Rate
    4.2. TSMC：Production Capacity Forecast by Process Node
    4.3. TSMC：Wafer Revenue by Process Node
    4.4. Wafer Shipment of TSMC Customers by Advanced Process Node
    4.5. Samsung Foundry：Advanced Process Wafer Capacity & Shipment, Utilization & Yield Rate
    4.6. Samsung Foundry Production Capacity Forecast by Process Node
    4.7. Samsung Foundry：Wafer Revenue by Process Node
    4.8. Wafer Shipment of Samsung Foundry Customers by Advanced Process Node
    4.9. GlobalFoundries：Advanced Process Wafer Capacity & Shipment, Utilization & Yield Rate
    4.10. GlobalFoundries：Production Capacity Forecast by Process Node
    4.11. GlobalFoundries：Wafer Revenue by Process Node & Customers by Advanced Node
    4.12. SMIC：Advanced Process Wafer Capacity & Shipment, Utilization & Yield Rate
    4.13. SMIC：Production Capacity Forecast by Process Node
    4.14. SMIC：Wafer Revenue by Process Node & Customers by Advanced Node
    4.15. UMC：Wafer Revenue by Process Node
    4.16. UMC：Production Capacity Forecast by Process Node