2nd Half 2021 Market Analysis of Major IC Foundry Production & Shipment

This report covers major foundries production capacity, expansion plan, wafer shipment by applications and customers by advanced process node.

Coverage of advanced process node：11/12/14/16nm, 8/10nm, 6/7nm, 4/5nm, 3nm

It is also a multi-client survey report intended to be of help to businesses involved in semiconductor industry when they plan marketing strategies, so that they can do so with an accurate understanding of the global market trends. (Memory segments are not included in this report.)

I. Executive Summary
    1.1. Market Overview of Semiconductor Foundries Industry
    1.2. Total Revenue Trends of Major IC Foundries
    1.3. Advanced Process Node: Shipment Revenue & Shipment by Applications
    1.4. Advanced Process Node: Production Capacity & Maker Share in 2021F
    1.5. 3nm Shipment Revenue and Capacity Trends (CY2020-CY2023)
    1.6. 3nm Capacity by IC Foundry and Customers 2021F 
    1.7. 4/5nm Shipment Revenue and Capacity Trends (CY2020-CY2023)
    1.8. 4/5nm Capacity by IC Foundry and Customers 2021F 
    1.9. 6/7nm Shipment Revenue and Capacity Trends (CY2020-CY2023)
    1.10. 6/7nm Capacity by IC Foundry and Customers 2021F 
    1.11. 8/10nm Shipment Revenue and Capacity Trends (CY2020-CY2023)
    1.12. 8/10nm Capacity by IC Foundry and Customers 2021F
    1.13. 11/12/14/16nm Shipment Revenue and Capacity Trends (CY2020-CY2023)
    1.14. 11/12/14/16nm Capacity by IC Foundry and Customers 2021F
    1.15. Manufacturing Process Procedure of Semiconductor 
    1.16. 12inch Capacity and Utilization Rate Forecast 
    1.17. Increasing of Inventory Turnover Day (TSMC & UMC)
II. Market Overview by Advanced Process Node
    2.1. Process Node by Major Applications
    2.2. Process Node Migration by Major Applications
    2.3. Process Node Coverage by IC foundries 
    2.4. Market Overview of Each Advanced Process Node 
    2.5. Market Overview of 3nm Process Node
    2.6. Possible Customers 3nm Process Node
    2.7. Market Overview of 4/5nm Process Node
    2.8. Wafer Shipment Volumes of 5nm by Applications 
    2.9. Wafer Shipment Volumes of 5nm by Customers 
    2.10. Market Overview of 6/7nm Process Node
    2.11. Wafer Shipment Volumes of 6/7nm by Applications
    2.12. Wafer Shipment Volumes of 6/7nm by Customers 
    2.13. Market Overview of 8/10nm Process Node
    2.14. Wafer Shipment Volumes of 8/10nm by Applications 
    2.15. Wafer Shipment Volumes of 8/10nm by Customers 
    2.16. Market Overview of 11/12/14/16nm Process Node
    2.17. Wafer Shipment Volumes of 11/12/14/16nm by Applications 
    2.18. Wafer Shipment Volumes of 11/12/14/16nm by Customers 1
    2.19. Wafer Shipment Volumes of 11/12/14/16nm by Customers 2
    2.20. Wafer Shipment Volumes of 11/12/14/16nm by Customers 3
    2.21. Capacity Expansion Trends by Node
    2.22. 28nm Process Node Capacity Expansion & Market Share
    2.23. Major Legacy Process Node List (28nm, 40nm, 55/65nm)
    2.24. IC Foundries Including Tier2 Foundries Revenue Share 2021-2023
    2.25. Wafer Average ASP by Process Node
III. Market Topics
    3.1. New Packaging Technologies by IC Foundry (TSMC & Samsung Foundry)
    3.2. Market Trend of Chiplet Technology
    3.3. Structure of Chiplet Technology
    3.4. Intel IDM 2.0 Business Strategy
    3.5. Intel Process Node Roadmap
    3.6. Advanced Process Roadmap by TSMC ＆ Samsung Foundry
    3.7. FinFET (Fin Field-Effect Transistor) and GAA (Gate All Around) for Advanced Node
    3.8. New Structure of Transistor：Post GAA (Gate All Around)
    3.9. PPA(Power, Performance, Area) Improvements of New Process Technologies
    3.10. Mask Blanks and Photo Mask Entries Makers Trends
    3.11. Entry Schedule of Metal Resist 
    3.12. Resist Market Share & JSR Acquisition of Inpria
    3.13. Inspection of EUV Photo Mask
    3.14. ASML: Revenue & EUV equipment shipment forecast
    3.15. ASML：Forecast of EUV Shipments
    3.16. Capital Expenditure Forecast by IC Foundries
    3.17. Topics of Accident, Electric Power Down, Shut Down Operation
    3.18. Topics of Accident, Electric Power Down, Shut Down Operation From 2nd Half 2020 1
    3.19. Topics of Accident, Electric Power Down, Shut Down Operation From 2nd Half 2020 2
    3.20. Topics of Accident, Electric Power Down, Shut Down Operation From 2nd Half 2020 3
    3.21. Topics of Accident, Electric Power Down, Shut Down Operation From 2nd Half 2020 4
IV. Individual Sheets
    4.1. TSMC：Advanced Process Wafer Capacity & Shipment, Utilization & Yield Rate
    4.2. TSMC：Production Capacity Forecast by Process Node
    4.3. TSMC：Wafer Revenue by Process Node
    4.4. Wafer Shipment of TSMC Customers by Advanced Process Node
    4.5. Samsung Foundry：Advanced Process Wafer Capacity & Shipment, Utilization & Yield Rate
    4.6. Samsung Foundry Production Capacity Forecast by Process Node
    4.7. Samsung Foundry：Wafer Revenue by Process Node
    4.8. Wafer Shipment of Samsung Foundry Customers by Advanced Process Node
    4.9. GlobalFoundries：Advanced Process Wafer Capacity & Shipment, Utilization & Yield Rate
    4.10. GlobalFoundries：Production Capacity Forecast by Process Node
    4.11. GlobalFoundries：Wafer Revenue by Process Node & Customers by Advanced Node
    4.12. SMIC：Advanced Process Wafer Capacity & Shipment, Utilization & Yield Rate
    4.13. SMIC：Production Capacity Forecast by Process Node
    4.14. SMIC：Wafer Revenue by Process Node & Customers by Advanced Node
    4.15. UMC：Wafer Revenue by Process Node
    4.16. UMC：Production Capacity Forecast by Process Node