I. Executive Summary
1. Market Overview of Semiconductor Foundries Industry
2. Total Revenue Trends of Major IC Foundries
3. Advanced Process Node: Shipment Revenue & Shipment by Applications
4. Advanced Process Node: Production Capacity & Maker Share in 2021F
5. 4/5nm Shipment Revenue and Capacity Trends (CY2020-CY2022)
6. 4/5nm Capacity by IC Foundry and Customers 2021F
7. 6/7nm Shipment Revenue and Capacity Trends (CY2020-CY2022)
8. 6/7nm Capacity by IC Foundry and Customers 2021F
9. 8/10nm Shipment Revenue and Capacity Trends (CY2020-CY2022)
10. 8/10nm Capacity by IC Foundry and Customers 2021F
11. 11/12/14/16nm Shipment Revenue and Capacity Trends (CY2020-CY2022)
12. 11/12/14/16nm Capacity by IC Foundry and Customers 2021F
13. Major IC Foundries Revenue & Capacity by Advanced Nodes
14. Major Countries Supporting Strategies for Semiconductor Industry
15. Movement of Major Countries & major IC Foundries
II. Market Overview by Advanced Process Node
1. Process Node by Major Applications
2. Process Node Migration by major Applications
3. Process Node Coverage by IC foundries
4. Market Overview by Advanced Process Node
5. Market Overview of 3nm Process Node
6. Market Overview of 5nm Process Node
7. Wafer Shipment Volumes of 5nm by Applications
8. Wafer Shipment Volumes of 5nm by Customers
9. Market Overview of 7nm Process Node
10. Wafer Shipment Volumes of 7nm by Applications
11. Wafer Shipment Volumes of 7nm by Customers
12. Market Overview of 8/10nm Process Node
13. Wafer Shipment Volumes of 8/10nm by Applications
14. Wafer Shipment Volumes of 8/10nm by Customers
15. Market Overview of 11/12/14/16nm Process Node
16. Wafer Shipment Volumes of 11/12/14/16nm by Applications
17. Wafer Shipment Volumes of 11/12/14/16nm by Customers 1
18. Wafer Shipment Volumes of 11/12/14/16nm by Customers 2
19. Wafer Shipment Volumes of 11/12/14/16nm by Customers 3
20. Major Legacy Process Node List (28nm, 40nm, 55/65nm)
21. Wafer Average ASP by Process Node
III. Market Topics
1. New Packaging Technologies by IC Foundry (TSMC & Samsung Foundry)
2. Intel IDM 2.0 Business Strategy
3. Intel Process Node Roadmap
4. Capital Expenditure Forecast by IC Foundries
5. ASML: Revenue & EUV equipment shipment forecast
6. ASML:Forecast of EUV Shipments
7. Advanced Process Roadmap by TSMC & Samsung Foundry
8. FinFET (Fin Field-Effect Transistor) とGAA (Gate All Around) for Advanced Node
9. PPA (Power, Performance, Area) Improvements of New Process Technologies
10. Topics of Accident, Electric Power Down, Shut Down Operation
11. Topics of Accident, Electric Power Down, Shut Down Operation From 2nd Half 2020 1
12. Topics of Accident, Electric Power Down, Shut Down Operation From 2nd Half 2020 2
13. Topics of Accident, Electric Power Down, Shut Down Operation From 2nd Half 2020 3
14. Topics of Accident, Electric Power Down, Shut Down Operation From 2nd Half 2020 4
IV. Individual Sheets
1. TSMC:Advanced Process Wafer Capacity & Shipment, Utilization & Yield Rate
2. TSMC:Production Capacity Forecast by Process Node
3. TSMC:Wafer Revenue by Process Node
4. Wafer Shipment of TSMC Customers by Advanced Process Node
5. Samsung Foundry:Advanced Process Wafer Capacity & Shipment, Utilization & Yield Rate
6. Samsung Foundry Production Capacity Forecast by Process Node
7. Samsung Foundry:Wafer Revenue by Process Node
8. Wafer Shipment of Samsung Foundry Customers by Advanced Process Node
9. SMIC:Advanced Process Wafer Capacity & Shipment, Utilization & Yield Rate
10. SMIC:Production Capacity Forecast by Process Node
11. SMIC:Wafer Revenue by Process Node & Customers by Advanced Node
12. GlobalFoundries:Advanced Process Wafer Capacity & Shipment, Utilization & Yield Rate
13. GlobalFoundries:Production Capacity Forecast by Process Node
14. GlobalFoundries:Wafer Revenue by Process Node & Customers by Advanced Node
15. UMC:Wafer Revenue by Process Node
16. UMC:Production Capacity Forecast by Process Node