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2025 Mobile Phone Platform & RF Front End Module Market

発刊年月 2025/9
体裁 A4 :127ページ
価格(税抜価格表示)
380,000円(日本語/ハードコピー + PDF+Excelデータ)
概要
本レポートはSmartphone Application Processor、ModemとRF Front End Module市場を分析したレポートです。レポートでは携帯電話端末及びMobile application processor、modem-RF、RF Front end moduleの市場予測と分析、サプライヤ、製品、新機能や技術、サプライチェーンの動向等を調査しています。
 
目次
1. Summary
    1.1. Market Trend Summary
    1.2. Smartphone Market Forecast by Standard
    1.3. Smartphone Market Forecast by Chipset-tier
    1.4. Smartphone Feature Forecast (On-device GenAI, Satellite Connectivity)
    1.5. Smartphone Chipset Revenue and ASP Forecast
    1.6. Smartphone RF Front End Module Adoption Rate
    1.7. Smartphone RF Front End Module Market Forecast
    1.8. Chinese Supplier Market Share Trend
    1.9. Smartphone Chipset Market Share Trend
    1.10. Premium Smartphone Chipset Roadmap
    1.11. RF Front End Platform Roadmap
2. Cellular Standard & Band
    2.1. 3GPP Standard Roadmap
    2.2. Cellular Spectrum Band
        2.2.1. Cellular Band Group
        2.2.2. 5G Spectrum Band by Area
        2.2.3. 6G Band
        2.2.4. List of 3GPP/5G NR Band
    2.3. Major 5G Network Operator
3. Market Forecast
    3.1. Mobile Phone Market Forecast
        3.1.1 Mobile Phone Market Forecast by Device Type
        3.1.2. Smartphone Market Forecast by Area
        3.1.3. Smartphone Market Forecast by Standard
        3.1.4. 5G/6G Smartphone Market Forecast by NR Band
        3.1.5. On-Device Generative AI Smartphone Market Forecast
        3.1.6. Smartphone with Satellite Connectivity Market Forecast
        3.1.7. Apple iPhone Market Forecast
        3.1.8. Huawei Smartphone Shipment Forecast
        3.1.9. Feature Phone Market Forecast by Area
        3.1.10. Feature Phone Market Forecast by Standard
        3.1.11. Mobile Phone and Smartphone Market Forecast Breakdown
    3.2. Smartphone Market Share Trend
        3.2.1. Smartphone Market Share
        3.2.2. 5G Smartphone Market Share
        3.2.3. Smartphone Market Share by Cellular Standard
4. Chipset & RF Front End
    4.1. Smartphone Chipset & RF Front End Supplier List
    4.2. Smartphone AP-Modem-RF-Front End Module Description
    4.3. Smartphone Chipset Roadmap
    4.4. RF Front End Module Roadmap
        4.4.1. RF Front End Platform Roadmap (Phase 2/5/7/8)
        4.4.2. 5G Ultra High Band Module Integration Trend
        4.4.3. 5G NTN (Satellite) RF Front End
        4.4.4. 6G FR3/6-7GHz RF Module
        4.4.5. 5G mmWave Module
        4.4.6. RF Filter
    4.5. Supply Matrix
        4.5.1. Smartphone Chipset Supply Matrix and Share
        4.5.2. RFFE Module Adoption Rate by Major Smartphone OEM
        4.5.3. RF Front End Module Supplier-Main Customer
        4.5.4. RF Front End Module - Component Supply Matrix
        4.5.5. Chipset & RF Front End Trend by Major Smartphone OEM
    4.6. Smartphone Chipset Market Forecast
        4.6.1. Smartphone Market Forecast by Chipset-tier
        4.6.2. Smartphone Chipset Revenue Market Forecast
        4.6.3. Smartphone Chipset Average Price Forecast
        4.6.4. Smartphone Chipset Price Range
        4.6.5. Smartphone Market Forecast by Modem/AP SoC and 2 Chip Solution
        4.6.6. Smartphone Processor (Modem, AP) Market Forecast by Process Node
        4.6.7. Smartphone Chipset Shipment by Foundry/ Process Node
    4.7. Smartphone RF Front End Module Market Forecast
        4.7.1. RF Front End Module Adoption Rate
        4.7.2. Smartphone RF Front End Module Market Forecast
        4.7.3. Smartphone RF Front End Module Price Forecast
    4.8. Smartphone Chipset & RF Front End Module Market Share
        4.8.1. Supplier Financial Data (2023-2025E)
        4.8.2. Smartphone Chipset Shipments and Revenue by Supplier (IC shipment base)
        4.8.3. Smartphone Chipset Market Share (Handset shipment base)
        4.8.4. Smartphone Application Processor Vendor Shipment by Customer
        4.8.5. Premium-tier Smartphone Application Processor Market Share
        4.8.6. Chipset Share in Samsung Premium Smartphone
    4.9. Smartphone RF Front End Module Market Share
        4.9.1. PA Module Market Share
        4.9.2. Diversity Receive Module Market Share
        4.9.3. 5G mmWave Module Market Share
        4.9.4. Major Suppliers of Discrete Component
        4.9.5. China RF Front End Module Market Share
    4.10. Major M&A
    4.11. Advanced Logic Process Migration
        4.11.1. Smartphone AP Process Migration Trend
        4.11.2. Wafer and Die Cost Estimation
    4.12. Premium Mobile Processor Packaging Trend
    4.13. Smartphone Chipset & RF Front End Module List

* Market Forecast Period: CY2023-2031 * Market Share Period: CY2024-2026