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Techno Systems Research Co., Ltd.

Research

Mobile & WirelessCellular Phone

Title

2009 Mobile Phone Platform Market & Development

Pub Date
2009/8
Size & Pages
A4 : 150 Pages
Price
JPY350,000 (Japanese Ver./PDF data / Additional Hardcopy JPY50,000- )
US$4,000 (English Ver./PDF data / Additional Hardcopy US$500-)
Outline

In the mobile phone market, platform adoption progresses to communalize application/service and to reduce handset development cost. Many operators and handset vendors are considering adopting Android and supporting A-CPU is increasing.

SoC is increasing in smart phone and low cost handset chipset segment. In a smart phone and low cost handset segment, BB/ACPU SoC and BB/RF SoC is becoming the mainstream respectively.

Penetration of 3G high speed communication and flat rate plan, improvement of UI lead to increase in web base service and application store. CPU power, low power consumption and interface technology such as sensor and GPS will be important for handset platform.

This report focuses on device market, analyzing baseband processor and A-CPU trend, supply chain, roadmap etc. It also covers web base service, demand forecast by region/ telecommunications standard, and demand characteristic of devices.

Contents
  1. Summary
    • 1.1. TSR Perspectives
    • 1.2 Mobile Industry Map
    • 1.3 PC Internet to Mobile Device Internet
    • 1.4 Mobile Phone Market Forecast by Standard
    • 1.5 WCDMA Handset & Baseband Vendor Market Share Trend (CY2007-2009)
    • 1.6 Smart Phone Market Forecast by OS Platform
    • 1.7 Smart Phone & A-CPU Vendor Market Share Trend (CY2007-2009)
    • 1.8 Mobile Phone Chipset Composition Trend
    • 1.9 Platform Vendors Position
  2. Cellular Standards
    • 2.1. Cellular Standards Roadmap
    • 2.2. Mobile Phone Application Roadmap1
    • 2.3. 3G Adoption by Major Mobile Operator
    • 2.4. Mobile Subscriber Forecast by Area
    • 2.5 Mobile Operator Share
    • 2.6 Topics: LTE Adoption Schedule
  3. Mobile Phone Market
    • 3.1. Mobile Phone Market Forecast (CY2007-2013)
      • 3.1.1. Mobile Phone Market Forecast by Standard
      • 3.1.2. Mobile Phone Market Forecast by Area
    • 3.2 Smart Phone Forecast by OS (CY2007-2013)
    • 3.3 Mobile Phone Function Penetration Forecast (CY2007-2013)
    • 3.4 Mobile Phone Vendor Share by Standard (CY2007-2009F)
      • 3.4 1 General
      • 3.4.2 WCDMA/ TD-SCDMA
      • 3.4.3 GSM/EDGE
      • 3.4.4 CDMA1x/EV-DO
    • 3.5 Smart Phone Vendor Share by OS (CY2007-2009F)
      • 3.5.1 General
      • 3.5.2 Symbian
      • 3.5.3 Limo
      • 3.5.4 Android
      • 3.5.5 Windows Mobile
  4. Mobile Internet Service
    • 4.1 Major Internet Service Menu
    • 4.2 Mobile Application Store
    • 4.3 Representative Business Model of Mobile Application Store
    • 4.4 Internet Service Technology
    • 4.5 Internet Application Platform
  5. Platform
    • 5.1 Mobile Platform Chipset Composition Trend
    • 5.2 Platform Vendor List
    • 5.3 Supply Chain
      • 5.3.1 Value Chain by Major Handset Vendor
      • 5.3.2 Baseband LSI
    • 5.4 Platform Roadmap by Major Handset Vendor
      • 5.4.1 Nokia
      • 5.4.2 Samsung
      • 5.4.3 Motorola
      • 5.4.4 LG
      • 5.4.5 Sony-Ericsson
      • 5.4.6 Sharp
      • 5.4.7 PMC
      • 5.4.8 NEC
    • 5.5 Mobile Platform Semiconductor Market Forecast (CY2007-2013)
    • 5.6 Platform Vendor Share (CY2007-2008)
      • 5.6.1 Baseband Processor Vendor Share
        • 5.6.1.1 WCDMA/HSDPA/TD-SCDMA
        • 5.6.1.2 GSM/EDGE
        • 5.6.1.3 CDMA1x/EV-DO
      • 5.6.2 A-CPU Vendor Share
        • 5.6.2.1 Symbian
        • 5.6.2.2 Limo
        • 5.6.2.3 Android
        • 5.6.2.4 Windows Mobile
      • 5.6.3 Multimedia Co-Processor Share
    • 5.7 Platform Semiconductor Pricing Forecast
      • 5.7.1 Baseband Processor
      • 5.7.2 A-CPU/ Multimedia Co-Processor
    • 5.8 Platform Roadmap/ Development Trend
      • 5.8.1 Integration Trend (RF/BB, BB/A-CPU, RF/BB/A-CPU)
      • 5.8.2 LTE Baseband Development
      • 5.8.3 BB/RF/PMU SoC
      • 5.8.4 BB/A-CPU SoC
      • 5.8.5 Clock Speed, Dual Core Trend
      • 5.8.6 OS Trend
      • 5.8.7 Roadmap by Major Chipset Vendors
    • 5.9 Platform IC Vendor Case Studies
      • 5.9.1 Infineon
      • 5.9.2 Intel
      • 5.9.3 Marvell
      • 5.9.4 NEC Electronics
      • 5.9.5 NVIDIA
      • 5.9.6 Panasonic
      • 5.9.7 Qualcomm
      • 5.9.8 Renesas
      • 5.9.9 Samsung
      • 5.9.10 ST-Ericsson
      • 5.9.11 Texas Instruments
      • 5.9.12 Toshiba
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